Modules are crucial electronic devices for image capture. In order to ensure the high reliability, stability, and subsequent service life of the camera module and fingerprint module, improve the yield of each process of the module, and avoid product scrapping caused by pollutant pollution, it is necessary to remove process pollutants on the surface of the camera module and fingerprint module, such as various solder paste residues, flux residues, oil stains, fingerprints, metal oxide layers, electrostatic particles, and particles. This cleaning process is to ensure that there are no dust or rinse residue on the graphics sensor and ensure the perfect image clarity of the camera module, and to avoid functional defects such as pixels.