Chip lead frame/discrete device cleaning: Lead frame type discrete devices are welded to the substrate and lead frame separately during chip soldering process. The high-temperature lead-containing solder paste used in this welding poses higher requirements for the cleaning process: removing flux residues and production residues, removing copper surface oxides, and having good compatibility with the frame material and silicon passivation layer. The water-based cleaning agent developed by Unibright perfectly meets the above requirements, creating excellent production conditions for subsequent Bonding.



Unibright provides you with professional chip lead frames/discrete device water-based cleaning process solutions.