In the SMT solder paste welding process, the solder paste printing stencil needs to undergo regular offline cleaning, which is an essential process and operation mode in the SMT process. The cleanliness of the SMT steel mesh directly affects the graphic accuracy and solder paste quantity of solder paste printing, ensuring the quality of solder paste welding and reducing solder joint defects is a very important link, especially for high-precision and closely spaced printing.

Many manufacturers' existing stencil cleaning equipment often uses traditional pneumatic spray machines, which use organic solvent, based cleaning agents or alcohol for stencil cleaning. This method solves the problem of low reliability of manual cleaning and no guarantee of cleaning cleanliness. The automatic cleaning method achieves continuous and complete cleaning of the steel mesh. However, with the improvement of environmental and safety requirements, the method of cleaning the stencil with solvent based cleaning agents is gradually changing and changing. The use of environmentally friendly water-based cleaning agents in conjunction with cleaning machines for stencil cleaning has become the direction and trend of SMT printing stencil cleaning.