Halogen free and no clean flux 881 Introduction

881 is a halogen-free and environmentally friendly soldering flux with low solid content. It is a soldering flux for electronic products and photovoltaic welding strips. It is applicable to immersion, spray, coating methods, and lead-free alloy solders such as Sn-Pb, Sn-Ag-Cu, Sn-Cu, etc. It is suitable for electronic communication products, computer automation products, precision instruments, and other products that require high quality and reliability.

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Halogen free and no clean flux 881 Product Features

? 881 halogen-free and environmentally friendly soldering flux has a full and bright solder joint after welding.
? The residue on the board surface is minimal and has a very high surface insulation impedance (S.I.R)
? Fast drying and other characteristics make it excellent in photovoltaic copper strip tin plating.
? Suitable for products that require high quality and reliability.
? Able to meet the requirements of high-quality and stable welding operations in lead-free production of electronic products, without affecting the testing program, and can easily pass the test.

Halogen free and no clean flux 881 Applicable process

Soldering flux for electronic products and photovoltaic welding strips. It is applicable to dipping, spray and coating methods.

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Halogen free and no clean flux 881 Application

? The density and uniformity of the flux coating have a critical impact on its successful application. The spray method can best exert the effect of no cleaning flux.

? Heming 881 lead-free soldering flux is suitable for lead-free alloy solders such as Sn-Ag-Cu and Sn-Cu.

? Use compressed air spray that is degreased, dewatered and cooled. Non operational states should avoid contact between flux and air as much as possible to avoid reducing the service life of flux. When it is found that the flux has become turbid or suspended, the flux in the groove should be removed in a timely manner, the flux container should be cleaned, and the flux should be replaced.

? When using peak equipment, it is recommended to preheat at 110 ± 10 ℃ to facilitate pre activation of the flux and improve the welding effect.

? During spray operation, pay attention to the adjustment of the nozzle, and make sure that the flux is evenly distributed on the PCB surface.